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c f p 1 5 PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier 16 april 2014 product data sheet scan or click this qr code to view the latest information for this product 1. general description planar maximum efficiency general application (mega) schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a sot1289 (cfp15) power and flat lead surface-mounted device (smd) plastic package. 2. features and benefits ? average forward current: i f(av) 10 a ? reverse voltage: v r 45 v ? low forward voltage ? high power capability due to clip-bonding technology and heat sink ? small and thin smd power plastic package, typical height 0.78 mm 3. applications ? low voltage rectification ? high efficiency dc-to-dc conversion ? switch mode power supply ? freewheeling application ? reverse polarity protection ? low power consumption application 4. quick reference data table 1. quick reference data symbol parameter conditions min typ max unit i f(av) average forward current = 0.5; f = 20 khz; t sp 130 c; square wave - - 10 a v r reverse voltage t j = 25 c - - 45 v v f forward voltage i f = 10 a; t p 300 s; 0.02; t j = 25 c; pulsed - 473 540 mv v r = 10 v; t p 3 ms; = 0.3; t j = 25 c; pulsed - 13 30 a i r reverse current v r = 45 v; t p 3 ms; = 0.3; t j = 25 c; pulsed - 150 500 a
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 2 / 14 5. pinning information table 2. pinning information pin symbol description simplified outline graphic symbol 1 a anode 2 a anode 3 k cathode 1 2 3 cfp15 (sot1289) aaa-009063 a k a 6. ordering information table 3. ordering information package type number name description version PMEG45A10EPD cfp15 plastic, thermal enhanced ultra thin smd package; 3 leads; body: 5.8 x 4.3 x 0.78 mm sot1289 7. marking table 4. marking codes type number marking code PMEG45A10EPD 4510 aaaa 8. limiting values table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v r reverse voltage t j = 25 c - 45 v i f forward current t sp = 125 c; = 1 - 14 a i f(av) average forward current = 0.5; f = 20 khz; t sp 130 c; square wave - 10 a i fsm non-repetitive peak forward current t p = 8 ms; t j(init) = 25 c; square wave - 170 a [1] - 0.9 w [2] - 1.2 w p tot total power dissipation t amb 25 c [3] - 3 w t j junction temperature - 150 c t amb ambient temperature -55 150 c
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 3 / 14 symbol parameter conditions min max unit t stg storage temperature -65 150 c [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . [3] device mounted on a ceramic printed-circuit board (pcb), al 2 o 3 , standard footprint. 9. thermal characteristics table 6. thermal characteristics symbol parameter conditions min typ max unit [1] [2] - - 165 k/w [1] [3] - - 120 k/w r th(j-a) thermal resistance from junction to ambient in free air [1] [4] - - 50 k/w r th(j-sp) thermal resistance from junction to solder point [5] - - 4 k/w [1] for schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses p r are a significant part of the total power losses. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [3] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . [4] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. [5] soldering point of cathode tab. aaa-012456 1 0 1 1 0 2 1 0 3 z th(j-a) (k/w) 1 0 - 1 t p (s) 1 0 - 3 1 0 2 1 0 3 1 0 1 1 0 - 2 1 0 - 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 fr4 pcb, standard footprint fig. 1. transient thermal impedance from junction to ambient as a function of pulse duration; typical values
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 4 / 14 aaa-012457 1 0 1 1 0 2 1 0 3 z th(j-a) (k/w) 1 0 - 1 t p (s) 1 0 - 3 1 0 2 1 0 3 1 0 1 1 0 - 2 1 0 - 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 fr4 pcb, mounting pad for cathode 1 cm 2 fig. 2. transient thermal impedance from junction to ambient as a function of pulse duration; typical values aaa-012458 1 0 1 1 0 2 1 0 3 z th(j-a) (k/w) 1 0 - 1 t p (s) 1 0 - 3 1 0 2 1 0 3 1 0 1 1 0 - 2 1 0 - 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 ceramic pcb, al 2 o 3 , standard footprint fig. 3. transient thermal impedance from junction to ambient as a function of pulse duration; typical values
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 5 / 14 10. characteristics table 7. characteristics symbol parameter conditions min typ max unit i f = 1 a; t p 300 s; 0.02; t j = 25 c; pulsed - 330 380 mv i f = 2 a; t p 300 s; 0.02; t j = 25 c; pulsed - 357 - mv i f = 3 a; t p 300 s; 0.02; t j = 25 c; pulsed - 377 - mv i f = 5 a; t p 300 s; 0.02; t j = 25 c; pulsed - 409 470 mv v f forward voltage i f = 10 a; t p 300 s; 0.02; t j = 25 c; pulsed - 473 540 mv v r = 5 v; t p 3 ms; = 0.3; t j = 25 c; pulsed - 10 - a v r = 10 v; t p 3 ms; = 0.3; t j = 25 c; pulsed - 13 30 a v r = 30 v; t p 3 ms; = 0.3; t j = 25 c; pulsed - 36 - a v r = 45 v; t p 3 ms; = 0.3; t j = 25 c; pulsed - 150 500 a i r reverse current v r = 10 v; t p 3 ms; = 0.3; t j = 125 c; pulsed - 11 - ma v r = 1 v; f = 1 mhz; t j = 25 c - 715 - pf c d diode capacitance v r = 10 v; f = 1 mhz; t j = 25 c - 240 - pf t rr reverse recovery time ; step recovery i f = 0.5 a; i r = 0.5 a; i r(meas) = 0.1 a; t j = 25 c - 21 - ns t rr reverse recovery time ; ramp recovery di f /dt = 200 a/s; t j = 25 c; i f = 6 a; v r = 26 v - 13 - ns v (br)r reverse breakdown voltage i r = 5 ma; t j = 25 c; t p 1.2 ms; = 0.12; pulsed 45 - - v v frm peak forward recovery voltage i f = 0.5 a; di f /dt = 20 a/s; t j = 25 c - 317 - mv
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 6 / 14 aaa-009168 1 0 - 1 1 0 - 3 1 0 - 2 1 0 1 1 0 2 i f (a) 1 0 - 4 v f (v) 0 0.8 0.6 0.2 0.4 (1) (2) (3) (4) (5) (6) (1) t j = 150 c (2) t j = 125 c (3) t j = 100 c (4) t j = 85 c (5) t j = 25 c (6) t j = -40 c fig. 4. forward current as a function of forward voltage; typical values (pulsed condition) aaa-009169 1 1 0 - 1 1 0 - 2 1 0 - 3 1 0 - 4 1 0 - 5 1 0 - 6 1 0 - 7 1 0 - 8 i r (a) 1 0 - 9 v r (v) 0 5 0 4 0 2 0 3 0 1 0 (1) (2) (3) (4) (5) (6) (1) t j = 150 c (2) t j = 125 c (3) t j = 100 c (4) t j = 85 c (5) t j = 25 c (6) t j = -40 c fig. 5. reverse current as a function of reverse voltage; typical values (pulsed condition) v r (v) 0 4 5 3 0 1 5 aaa-012459 0.5 1.0 1.5 c d (nf) 0 f = 1 mhz; t amb = 25 c fig. 6. diode capacitance as a function of reverse voltage; typical values
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 7 / 14 11. test information t i m e i f i r t r r i r(meas) 006aad022 fig. 7. reverse recovery definition; step recovery 0 0 3 a a c 5 6 2 t r r t i m e 1 0 0 % 2 5 % i f d l f d t i r i r m q r fig. 8. reverse recovery definition; ramp recovery 0 0 1 a a b 9 1 2 t i m e t i m e v f r m v f i f v f fig. 9. forward recovery definition
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 8 / 14 t 1 t 2 p t 0 0 6 a a a 8 1 2 d u t y c y c l e = t 1 t 2 fig. 10. duty cycle definition the current ratings for the typical waveforms are calculated according to the equations: i f(av) = i m with i m defined as peak current, i rms = i f(av) at dc, and i rms = i m ? with i rms defined as rms current.
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 9 / 14 12. package outline references outline version european projection issue date iec jedec jeita sot1289 sot1289_po 13-07-12 13-08-27 unit m m max nom min 5.9 4.4 4.71 1.09 2.05 a dimensions (mm are the original dimensions) note 1. dimension a is excluding plating thickness. cfp15: plastic, thermal enhanced ultra thin smd package; 3 leads; body: 5.8 x 4.3 x 0.78 mm sot1289 c d 6.6 d 1 e e b b 1 4.01 b 2 b 3 l 3.31 l 1 l 2 1.2 0.78 0.2 5.8 4.3 2.13 4.61 6.5 0.99 1.95 3.91 3.21 0.25 1.1 5.7 4.2 4.51 6.4 1.19 2.15 4.11 3.41 1.3 0 2.5 5 mm scale 3 2 1 1 2 3 e d 1 d c b 3 l 1 b 1 b 2 (2x) b 3 (2x) l 2 (2x) l b a e fig. 11. package outline cfp15 (sot1289)
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 10 / 14 13. soldering footprint information for reflow soldering of cfp15 package sot1289 sot1289_fr dimensions in mm occupied area solder paste solder resist solder lands issue date 13-08-28 14-03-12 2 . 1 3 1 . 4 ( 2 ) 1 . 8 ( 2 ) 1 . 6 ( 2 ) 4 . 6 3 . 7 3 1 . 7 ( 4 ) 0 . 2 2 . 4 3 . 8 4 0 . 1 1 0 . 2 0 . 2 0 . 4 1 . 0 2 0 . 6 0 . 0 5 7.5 0 . 6 1 . 9 1 . 9 5.16 4 . 9 6 1 . 3 4 1 . 4 4 1.64 fig. 12. reflow soldering footprint for cfp15 (sot1289)
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 11 / 14 14. revision history table 8. revision history data sheet id release date data sheet status change notice supersedes PMEG45A10EPD v.2 20140416 product data sheet - PMEG45A10EPD v.1 modifications: ? product status changed PMEG45A10EPD v.1 20140217 objective data sheet - -
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 12 / 14 15. legal information 15.1 data sheet status document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objective specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. [1] please consult the most recently issued document before initiating or completing a design. [2] the term 'short data sheet' is explained in section "definitions". [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions preview the document is a preview version only. the document is still subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer, unless nxp semiconductors and customer have explicitly agreed otherwise in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 15.3 disclaimers limited warranty and liability information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customers sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customers applications and products planned, as well as for the planned application and use of customers third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customers applications or products, or the application or use by customers third party customer(s). customer is responsible for doing all necessary testing for the customers applications and products using nxp semiconductors products in order to avoid a default of the applications and the products or of the application or use by customers third party customer(s). nxp does not accept any liability in this respect. limiting values stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customers general terms and conditions with regard to the purchase of nxp semiconductors products by customer. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 13 / 14 grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. non-automotive qualified products unless this data sheet expressly states that this specific nxp semiconductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non- automotive qualified products in automotive equipment or applications. in the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors specifications such use shall be solely at customers own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond nxp semiconductors standard warranty and nxp semiconductors product specifications. translations a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 15.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. adelante , bitport , bitsound , coolflux , coreuse , desfire , ez-hv , fabkey , greenchip , hipersmart , hitag , i2c-bus logo, icode , i- code , itec , labelution , mifare , mifare plus , mifare ultralight , moreuse , qlpak , silicon tuner , siliconmax , smartxa , starplug , topfet , trenchmos , trimedia and ucode are trademarks of nxp semiconductors n.v. hd radio and hd radio logo are trademarks of ibiquity digital corporation.
nxp semiconductors PMEG45A10EPD 45 v, 10 a low vf mega schottky barrier rectifier PMEG45A10EPD all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved product data sheet 16 april 2014 14 / 14 16. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 pinning information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 8 limiting values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 9 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 test information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 15 legal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 ? nxp semiconductors n.v. 2014. all rights reserved for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 16 april 2014

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